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Deadline Extended! Sealed Bid Offering of Front End SiC and GaN Process Tools from US Fab

List includes tools from ASM, CHA Industries, Plasma Therm, Disco, Semiconductor Equipment Corp, etc.

Please Note:

  • Bid packets can be submitted at any time, prior to the closing date (December 17, 2021 - 3PM ET)
  • Removal & Loading fees are also noted where provided by the vendors. Please see item description for more details
  • All invoices must be paid within (5) days

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