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Listing #598257

TDK Corporation AFM-1503 Compact Ultrasonic Bonder

$95,000.00 USD Make An Offer
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Equipment Description

TDK Corporation AFM-1503 Compact Ultrasonic Bonder

  • Country of Origin: Japan
  • Maximum Wafer Size: 8 Inches


  • Does NOT include computer seen on top of machine
  • Internal photos are representative

    Equipment Specifications

    Conversion Tools
     StandardMetric
    Year2014 
    Serial NumberAFM-1A575 
    CE markedNO 
    ModelAFM-1503 
    Type of Media HandlerWAFER 
    Voltage200 VOLTS200 VOLTS
    Frequency50/60 HERTZ50/60 HERTZ
    Phase3 
    Current30 AMPS30 AMPS
    Recommended Packaging FormCRATE 
    Estimated Shipping Weight3527 LBS1599.85 kg
    Estimated Shipping Length63 IN1600.20 mm
    Estimated Shipping Width53 IN1346.20 mm
    Estimated Shipping Height86 IN2184.40 mm
    Disclaimers ▼
    This lot is being sold "as is, where is". We recommend that you contact an EquipNet sales representative to set up your own inspection. This item is located in Costa Rica.

    This equipment is subject to a removal and loading charge.

    Please Note: The seller of this equipment requires the buyer to accept a sales agreement. Click here to view the sales agreement.


    The written description provided for this equipment is EXACTLY what you will receive if you opt to purchase this listing. Any items that are not in the description but appear in the visual representations of this listing will not be included in the sale. Photos and video are provided just as references and to give a general sense of condition.

    Please be aware that weights and dimensions of equipment provided on EquipNet’s listings are estimates and can vary from actual weights and size. Sellers estimates are often not precise especially when equipment was installed versus prepped for shipment. As such, please do not fully rely on the accuracy of this information in EquipNet’s listings for shipping quotes and/or user size requirements.

    Any license associated with this equipment is non transferable.


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